五 形状与尺寸：

导线（通道）：conduction (track)
导线（体）宽度：conductor width
导线距离：conductor spacing
导线层：conductor layer
导线宽度/间距：conductor line/space
第一导线层：conductor layer No.1
圆形盘：round pad
方形盘：square pad
菱形盘：diamond pad
长方形焊盘：oblong pad
子弹形盘：bullet pad
泪滴盘：teardrop pad
雪人盘：snowman pad
V形盘：V-shaped pad
环形盘：annular pad
非圆形盘：non-circular pad
隔离盘：isolation pad
非功能连接盘：monfunctional pad
偏置连接盘：offset land
腹（背）裸盘：back-bard land
盘址：anchoring spaur
连接盘图形：land pattern
连接盘网格阵列：land grid array
孔环：annular ring
元件孔：component hole
安装孔：mounting hole
支撑孔：supported hole
非支撑孔：unsupported hole
导通孔：via
镀通孔：plated through hole (PTH)
余隙孔：access hole
盲孔：blind via (hole)
埋孔：buried via hole
埋/盲孔：buried /blind via
任意层内部导通孔：any layer inner via hole (ALIVH)
全部钻孔：all drilled hole
定位孔：toaling hole
无连接盘孔：landless hole
中间孔：interstitial hole
无连接盘导通孔：landless via hole
引导孔：pilot hole
端接全隙孔：terminal clearomee hole
准表面间镀覆孔：quasi-interfacing plated-through hole
准尺寸孔：dimensioned hole
在连接盘中导通孔：via-in-pad
孔位：hole location
孔密度：hole density
孔图：hole pattern
钻孔图：drill drawing
装配图：assembly drawing
印制板组装图：printed board assembly drawing
参考基准：datum referan